Tok i go pas long ol 'Polyamide Hot Melt Adhesives'

Polyamide hot melt adhesive, ol i save kolim tu olsem dimer acid polyamide hot melt adhesive, em i wanpela polima samting we ol i wokim long ol 'diacids' na 'diamines' long rot bilong 'copolimerization reaction', na bihain ol i wokim long rot bilong senisim na 'pulverization'. Wok bilong redim em i kamap long bikpela -temperature kondensesen bilong ol 'dimer acids' na 'polyamines', na ol i brukim i go long tupela lain: bikpela molekiul weit (gutpela ron bilong wara, strong bilong draim klinim) na liklik molekiul weit (strong na strongpela moa long EVA). Ol i save yusim planti taim long pasim ol laplap, leda, ain, na ol samting ol i wokim long graun, na tu long lukautim ol samting bilong elektronik na pasim ol buk.

Dispela samting i gat wanpela 'softening point range' bilong 100 digri i go antap long 200 digri, wanpela 'temperature tolerance' bilong -40 digri i go inap 200 digri, na wanpela 'specific gravity' bilong samting olsem 0.97 long rum tempereja. As kala bilong en em i 'amber', we yu ken senisim i go long blak, wait, o ol narapela kala sapos yu putim kabon blak, 'titanium dioxide', na ol narapela kala. Ol i mas putim 'raw material polyamine' insait long wanpela paket we wara i no inap go insait long en. Ol i mas yusim wantaim wanpela masin bilong pasim ol samting long hatpela melt, na ol i mas klinim ol ikwipmen oltaim long stopim bikpela hat bilong kabonaisesen na pas.