Tingting bilong 'high melting point polyamide hot melt adhesive'

High-melting-point hot-melt adhesive em i wanpela hot-melt adhesive wantaim polyamide resin olsem nambawan samting bilong en. Em i gat wanpela 'melting temperature' bilong 140-150 digri na ol i save yusim long wokim ol su olsem 'leather folding', 'cold pressing', na 'molding'. Wok bilong redim em i yusim 'dimer linoleic acid', 'sebacic acid', 'ethylenediamine', na 'hexamethylenediamine' olsem ol samting bilong wokim, na kamapim 'polyamide resin' long rot bilong 'high-temperature polycondensation reaction aninit long 'nitrogen protection'. Dispela proses i gat ol 'staged heating', 'depressurization', na 'amine value testing'.

Ol i ken senisim 'softening point' bilong dispela 'adhesive' sapos ol i stretim 'raw material ratio', na dispela i mekim em i gutpela long wokim long 140-200 digri. Long mekim gutpela wok long hai-temperature, ol i save putim 1% bilong wanpela 'pyrazole-based anti-aging agent (olsem 1-phenyl-3-pyrazole) long 'adhesive solution', na dispela i mekim wok i stap gut maski long 260 digri.