Hot Melt Adhesive bilong Electronics

Hot Melt Adhesive for Electronics i bin kamap stret long ol waitpela -kago, pawa-tul, LED-draiva na ol liklik-aplains manifektsa we i nidim hariap, klinpela asembli wantaim longpela taim-envairomen proteksen. Dispela glu i save kamaut gut long 150-170 digri long 11 mm glu gan o maikro-dispensing het, wetim ABS, PC, PP, aluminium na kopa na i no gat korosen o blum. Insait long 3-6 seken dispela bon i kol i go long wanpela strongpela, waitpela, non-yelo 'thermoplastic' we i save givim 3.5 MPa 'shear strength' long ol ABS/ABS join na i save abrusim 1000 aua long 70 digri /85 % RH na i no gat hevi i lus o bruk.

Wanpela 110 digri Ring-&-Ball softening poin we ol i stretim gut i save holim polima i stap strong taim ol samting i hatim em yet, tasol i larim ol i yusim long liklik tempereja we i save lukautim ol samting we i save pilim hat olsem ol SMD kapasitor na ol liklik plastik wol. Taim ol i putim pinis, glu i save kamapim wanpela wara-bloking film we i save pasim das- long ol 'enclosure seams', ol 'cord entries' na ol 'potting-fri PCB edges, na dispela i save daunim nid bilong ol silikon gasket o tupela-pat epoksi. Ol 'hydrogenated tackifying resins' i save rausim ol 'unsaturated double bonds', na dispela i save kamapim ol VOC emisen aninit long 50 μg g⁻¹ (EU ISO 16000-6) na ol 'odor levels' we i no inap long luksave long en long 50 mm distens, na dispela i helpim ol prodaksen lain long inapim ol standet bilong LEED, WELL na BSCI insait long ea.

Dispela marasin i no gat 100 pesen halogen, antimoni, hevi metal, phthalates na formaldehyde, na i bihainim RoHS 2.0, REACH SVHC 240. Ol tes bilong resistiviti i soim 3.8 × 1015 ε Ω volium strong resistiviti na 520 V/mil dielectric strong, na i mekim adhesive i stap klostu long seif V seket na ol LED solder poin. Dispela hot-melt stik i save pasim ol hap hariap, i no inap long kisim wara na das, i save stap long taim bilong kol na i save mekim ples wok i stap grin, Hot Melt Adhesive bilong Elektronik i givim wanpela redi-long yusim, kos-seving solusen we i save abrusim olgeta odiens.

Hot Tag: 'hot melt adhesive' bilong ol samting bilong elektronik, Saina hot melt 'adhesive' bilong ol kampani i wokim ol samting bilong elektronik, ol saplaia, faktori