Hot Melt Flooring Adhesive

 

1. APAO Polymer Backbone

Ol i wokim dispela 'adhesive' long 'amorphous poly-alpha-olefin (APAO), na dispela i givim em gutpela balens bilong 'aggressive tack', longpela taim bilong opim na 'elasticity' we i stap oltaim we i gutpela tru long ol 'silent-floor laminates.

 

2. Natural-Waitpela, Non-Blok i Yelo

Olgeta wan wan 1 kg pilo-seip blok em i waitpela tru, i no gat titanium daioksait o ol samting bilong lait long ai, olsem na em bai no inap senisim kala bilong ol lait-kala vinyl, WPC o SPC baksait leia maski em i stap longpela taim long UV.

 

3. Fully Compostable, Low-Melt Film Wrap

Ol wanwan blok i stap insait long wanpela 40 μm 'fusible film' we i save melt na kamap hap bilong 'hot melt flooring adhesive' long 170 digri, na dispela i save rausim ol pipia bilong paket na daunim taim bilong klinim ol 'melter'.

 

4. Stret Melt-Poin & Softening Windo

Wantaim wanpela Ring-&-Ball softening point bilong 130-140 digri, prodak i stap strong yet insait long ol haus kago long taim bilong san tasol i save ron isi long 160-180 digri, na i stopim 'stringing' na 'edge-bleed' long ol 'high-speed laminating lines.

 

5. Gutpela 170 digri Viskositi

Long 170 digri Brookfield viskositi em i 2 100 cP, i liklik inap long spiral sprei, slot-dai o gutpela-rol koting, tasol em i antap inap long stopim 'strike-through long open-cell EVA o IXPE acoustic pads.

 

6. Multi-Mode Application Flexibility

TH-8203B yu ken yusim long:

– engraved-roll transfer (2–8 g/ft2),

– random swirl spray (5-15 g/ft2),

– o slot-dai keten (10–25 g/ft2), i givim fridom long ol man i wokim plua long senisim namel long 'discrete plank lamination' na 'continuous sheet lines' na i no senisim 'adhesive SKU'.

 

7. Instant Green Strength & Fast Set

Dispela marasin i save kamap kristal insait long 8-12 s bihain long 'nip' i lusim long 25 digri ambient, na dispela i larim ol i ken bungim, putim long paket na 'skidizing' hariap tru-na i no gat wok long putim ol samting bilong pasim o putim ol aven bilong mekim 'curing'.

 

8. Bikpela Sevis-Tempereja Range

Bonds retain >80 % bilong namba wan strong bilong skin stat long –30 digri (kol-krak resistens) i go long +90 digri (ol kondisen bilong attik long taim bilong san), inap long EN 14293 na ASTM D7799 klaimet-saikel spesifikasen.

 

9. Gutpela Acoustic-Dampening Retention

Bikos APAO matriks i save stap fleksibel, IXPE o 'cork pad' we i gat 'laminated' i save holim yet 'impact-sound reduction (ΔLw Moa o wankain olsem 19 dB) bihain long 10 000 'rolling-load cycles, na i winim ol strongpela EVA o reactive PUR sistem.

 

10. Grin na Seif Kemistri

Dispela 'hot melt flooring adhesive' em i 100 % solids, zero formaldehyde, zero isocyanate na zero phthalate, na i bihainim FloorScore, REACH, TSCA na LEED v4 low-emitting materials criteria. VOC emisen<10 µg/m³ after 24 h (ISO 16000-6).

 

11. Gutpela Adhesen Potfolio

Ol 'bond values' i soim long ol 'substrates':

– SPC i go long IXPE: 3.8 N/mm peel (EN 431)

– WPC i go long kork: 4.1 N/mm skin

– LVT i go long non-woven glas: 3.5 N/mm skin

Feil mode i save pas gut insait long pad, i no save stap namel long pes.

 

12. Thermal & Hydrolytic Durability

72-aua sokim long 50 digri wara bihainim 24-aua ais long –20 digri i soim<5 % peel loss; 500-h Q-UVB exposure at 60 °C shows no delamination or embrittlement, outperforming standard EVA hot-melts by >3×.

 

13. Klinpela masin

Liklik smok (<5 mg/m³ @ 170 °C), minimal char and no gel formation after 48 h continuous pot life, reducing nozzle purge frequency and extending gear-pump service intervals.

 

14. Isipela Stoa na Handim

1 kg ol blok we ol i karamapim wanwan, 20 kg long wan wan katon. Laip bilong putim 24 mun aninit long 35 digri na<50 % R.H., no refrigeration needed.

 

 

MODEL NAMBA	TH-8203B	BREN	Tianze
SEIP	Blok	SAIS
KALA	Wait	OL BIKPELA INGREDIENT	APAO
SOFTENING POINT	130-140 digri	VISCOSITY @170digri	Daunbilo
OPEN TAIM		SETIM TAIM
PAKING	20kg/boks	SAMPEL	Fri sempel i stap

 

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